HI-Light LED Lamps

    Generally, HI-Light's LED Lamps can be used the same way as other general purposed semiconductors. However, the following precautions must be taken to protect the LED.


  CLEANING ： Do not use unspecified chemical liquid to clean LED, because they could harm the resin of the LED. For example, Tricholroethylene, Chlorosen, Acetone, and DiflonS3MC. If cleaning is necessary, please immerse the LED in alcohol or Freon TE at normal temperature for less than 1 minute, When other chemical solutions not specified are used, it may cause cracks or haze on the surfaces of the lens.

  FORMING :
1 ） Do not form the leads during or after soldering. If forming is required, it must be done before soldering.
2 ） Please remember that any pressure applied on resin can break gold wire in LED.
3 ） While forming, please use a tie bar cut or equivalent to hold or bend the pin.
4 ） 2mm form the base of resin is the minimum distance for the place bending the lead pin.
5 ） Avoid bending the lead pin at the same point twice or more.

  SOLDERING ：
1 ） Solder under the tie-bar cut (Fig.2). To hold pin leads with tweezers during soldering, especially for smaller LED.
2 ） If pressure is applied on LED while it is being on PC board, disconnection may occur during soldering or after mounting due to creep. Pin lead mounting holes must be coincided with original or formed pin lead pitch to prevent pressures.
3 ） During lead forming process, LED should not be added any stress. Otherwise, the disconnection may occur.
4 ） When an LED is mounted into a P.C. board, pitch spacing should be aligned carefully to avoid causing any stress to the lead wires. Otherwise, the stress will cause problem in high temperature operation. It is necessary for the LED to return to normal temperature for 3 minutes after the soldering operation. (Fig.3)
5 ） If soldering one line of LEDs on a P.C. board by using a soldering iron, do not solder both leads of the LED at the same time. (Fig. 4)
6 ） The soldering iron should be operated under 30W power consumption.
7 ） The LED soldering specification is shown as below: